한양대학교 EUV-IUCC

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2022-09-24: 미국 반도체 산업 정책(CHIPS and Science Act of 2022 Summary_220819
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2022-09-24: 반도체고급인력양성 추진전략(KEIT report)_220728
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2022-09-24: 반도체디스플레이과, 산업부, 관계부처 합동 「반도체 초강대국 달성전략」 발표자료(220721)
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2022-06-24: TEL IR(June.13.2022) 자료 update_220624
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2022-06-14: 2022 and Beyond for Memory Technology_TechInsight (최정동 박사)_0614
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2022-06-14: Micron 2022 Investor Day Presentation (5/12)
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2022-05-30: SPIE 2022 Intel Keynote_ 0.55NA EUV progress towards production in 2025
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2022-05-12: SPIE 2022 Advanced Lithography + Patterning : Proceeding 발표자료
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2022-05-03: 2022 EUVL Workshop & Supplier Showcase(2022. 06.04~06.09) : Agenda & Abstract
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2022-04-22: AMAT Investor Master Class(April.21) _New way to shrink master class_20220421
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2022-03-31: KEIT Issue report(22년 1월 & 2월) : 22대분야 연구개발 주요성과및 추진계획_시스템반도체, 반도체 공정장비, 금속재료 등
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2022-02-25: SPIE 2022 Advanced Lithography + Patterning : Dry Resist 발표 lists
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2022-02-24: ASML Annual (2021년도) Report US GAAP -
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2022-02-20: 2022 Intel Investor Meeting" 자료 공유_ Intel Foundary Service 外
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2022-02-20: 2022 Intel Investor Meeting" 자료 공유_ Intel Process Technology 外
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2022-01-11: TSMC 반도체 기술 동향및 성공요인 분석 report
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2022-01-10: AMAT2021 Process Control and Applied Master Class_Oct.18
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2022-01-07: ASMI Investor Day 2021_ Sep.28.21
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2022-01-06: [SRC Report] Decadal Plan for Semiconductors_Jan.2021
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2022-01-06: TEL IR Day Aiming to Be a Truly Excellent Global Company(Oct.12.21)
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2022-01-06: ASML Investor Day 2021_Sep.29 (Part II)
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2022-01-06: ASML Investor Day 2021_Sep.29 (Part I)
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2022-01-06: AMAT2021 ICAPS and Packaging Master Class_Sep.08
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2022-01-06: 2021년 EUVL Workshop 발표_IMEC(Progress and Outlook towards High-NA EUV Resist)_ June.10
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2022-01-06: 2021년 EUVL Workshop 발표_ASML(High NA EUV Progress and Outlook)_ June.08
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2022-01-06: AMAT 2021 Logic Master Class Presentation_June.16
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2022-01-06: AMAT 2021 Memory Master Class Presentation_May.05
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2022-01-06: AMAT Investor Meeting Review (April.06) _PPACt
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2022-01-05: " 美 마이크론, EUV D램용 설비 투자 ‘스타트’...삼성·SK 추격 고삐 " 및 Micron 분기실적발표
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2020-10-13: EUV-IUCC 회원가입 양식 자료
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리스트

KAIST 소재부품기술자문단... <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

General Optics <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

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칼자이스코리아 <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

GrapheneLab <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

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ASML <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

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도쿄일렉트론코리아 <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

파크시스템스 <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

디엔에프 <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

알파그래핀 <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

QRT <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

EGTM <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

바스프 <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

카이로스페이스 <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

휴넷플러스 <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

Veeco <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

Lam Research <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

EUV Inc. <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

넥스틴 <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

대한광통신 <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

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와이씨켐 <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

psk <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

Pedisem <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

fst <img src='/admin/bbsmain/image/file.gif' border='0' align='absmiddle'>

Expertise: EUV mask; EUV pellicle; EUV resist; Metrology & inspection; EUV mask cleaning; Simulation

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